In an exciting step toward promoting innovation and entrepreneurship on campus, Techno Main Salt Lake (TMSL) has signed a Memorandum of Understanding (MoU) with the IIM Calcutta Innovation Park – Technology and Innovation Council (IIMCIP-TIC) on June 11, 2025.
This partnership is all about helping engineering students turn their ideas into real-world projects and even startups. With this MoU, a new Build Club will be set up at TMSL to encourage hands-on learning, product development, and creative thinking.
What does this mean for students? A lot of opportunities! From workshops to mentorship, hackathons to demo days, and even internship support—students will get access to a wide range of resources. The club will be student-led, giving everyone the chance to take charge, innovate, and collaborate.
TMSL will provide a dedicated space on campus, complete with the right equipment and guidance from faculty members. On the other hand, IIMCIP-TIC will offer technical advice, project kits, expert mentorship, and a platform for students to connect with the broader start-up ecosystem.
One of the most exciting parts? Students with promising projects might even get a chance to be part of IIMCIP’s incubation network—meaning their ideas could turn into full-fledged startups!
The MoU is signed for three years, with the possibility to renew it and build even more programs in the future. It also sets clear guidelines for smooth collaboration, fairness, and transparency.
This initiative is a big leap toward making TMSL a hub of innovation and entrepreneurship. With the support of IIM Calcutta’s innovation wing, students now have a golden opportunity to dream big, build boldly, and possibly become the entrepreneurs of tomorrow.